Requirements for chip cooling

　　High heat dissipation efficiency: Chips generate a large amount of heat during operation, so an efficient cooling system is needed to ensure that the chip's temperature is kept within a safe range. An efficient cooling system can quickly transfer heat from the chip to the external environment, preventing overheating.

　　Low power consumption: With the popularization of green energy-saving and low-carbon environmental protection concepts, as well as the implementation of national dual carbon strategic goals, designing low-power, high-efficiency cooling systems has become a major challenge. The cooling system needs to minimize energy consumption while ensuring cooling effectiveness.

　　High thermal conductivity materials: The performance of materials is a key factor in determining the effectiveness of heat dissipation. Developing materials with higher thermal conductivity is a fundamental approach to solving electronic heat dissipation. Common high thermal conductivity materials include metals (such as copper and aluminum) and ceramic-based materials, which are often used for chip cooling in extreme environments due to their excellent thermal conductivity.

　　Multiple cooling technologies: Current popular cooling solutions in the industry include air cooling, liquid cooling technologies, and the use and innovation of cooling materials. Air cooling and liquid cooling are the main cooling methods, while thermal interface materials (TIM), metals, and ceramic-based thermal conductive materials also perform well in practical applications.

　　Noise control: While meeting cooling requirements, the cooling system also needs to control noise to ensure that excessive noise is not generated during operation, affecting user experience.

　　Cost considerations: The design and implementation of cooling systems need to take cost into account, ensuring that efficient cooling effects are achieved within a reasonable cost range.

　　Adaptation to different application scenarios: Cooling solutions need to be adaptable to different application scenarios, such as servers, laptops, gaming consoles, etc. These devices have varying cooling requirements, so it is necessary to design cooling solutions that can accommodate various scenarios.